
Product Overview
The Applied Materials 0040-00555 is a precision-engineered chamber shield designed for the demanding environment of semiconductor wafer fabrication. As a critical consumable component within Applied Materials process chambers, this AMAT 0040-00555 functions as the primary physical barrier between the plasma reaction zone and the chamber’s external structural components. Installed within PVD, CVD, and etch chambers, the 0040-00555 shield absorbs the impact of sputtered particles, reaction byproducts, and plasma corrosion, protecting expensive chamber walls, heaters, and electrodes from contamination and degradation.
Manufactured from high-purity 316L vacuum-grade stainless steel, the AMAT 0040-00555 undergoes electrolytic polishing and passivation treatment to achieve a surface roughness of Ra ≤ 0.8 μm. This precision surface finish is essential in semiconductor vacuum environments, as smoother surfaces minimize particle adhesion and facilitate more thorough chamber cleaning cycles. The 0040-00555 maintains a vacuum leakage rate of ≤ 1×10⁻⁹ mbar·L/s, ensuring that the shield itself does not compromise the ultra-high vacuum integrity required for critical thin-film deposition and etching processes.
The Applied Materials 0040-00555 represents a mature, field-proven design deployed across the Endura PVD, Centura CVD, and Producer Etch platform families. While the original manufacturer has transitioned this part to end-of-life status, the 0040-00555 remains a high-frequency replacement item in operational fabs, where chamber maintenance cycles continue to require this essential shield. Its compatibility with both 200mm and 300mm wafer platforms ensures continued relevance across multiple technology nodes and process applications.
Technical Specifications
| Parameter Name | Parameter Value |
|---|---|
| Product Model | AMAT 0040-00555 |
| Manufacturer | Applied Materials (AMAT) |
| Product Type | Chamber Shield / Front Shield |
| Primary Material | 316L Vacuum-Grade Stainless Steel |
| Surface Treatment | Electrolytic Polishing + Passivation |
| Surface Roughness | Ra ≤ 0.8 μm |
| Vacuum Leak Rate | ≤ 1×10⁻⁹ mbar·L/s |
| Operating Temperature | −20°C to +600°C (Vacuum Environment) |
| Compatible Gases | HF, H₂O₂, NH₃, Ar, N₂, O₂, SiH₄ |
| Compatible Platforms | Endura PVD, Centura CVD, Producer Etch |
| Wafer Compatibility | 200 mm / 300 mm |
| Alternative/Related Model | 0040-00550 (Front Shield variant) |
| Lifecycle Status | End-of-Life (EOL); Refurbished/Stock Available |
| Certification Standards | SEMI S2, SEMI F47; ASTM A240 |










