Technical Specifications
| Parameter Name | Parameter Value |
|---|---|
| Product Model | Kulicke & Soffa 8002-4192 |
| Manufacturer | Kulicke & Soffa Industries (K&S) |
| Product Type | I/O Temperature Board, PCB assembly |
| Product Series | K&S 8002-Series wire bonder control electronics |
| Primary Function | Temperature signal acquisition, I/O routing and thermal process feedback control within the wire bonder control architecture |
| Compatible Platform | Kulicke & Soffa wire bonder systems using the 8000-series electronics architecture; confirm against machine model and serial number |
| Signal Types Handled | Temperature sensor feedback from bond stage and workholder heaters, plus associated discrete and control I/O |
| I/O Configuration | Multiple temperature sensor inputs with corresponding control outputs for heater and process functions |
| Precision | High-precision analogue and digital signal handling with low drift design for repeatable thermal control |
| Board Construction | Industrial PCB assembly with shielded layout for electrically noisy bonder environments |
| Bus Interface | Card-edge connection to the bonder backplane or card cage, drawing logic power from the system supply |
| Supply Voltage | Logic and analogue rails supplied from the bonder power distribution; typical board-level service voltage 12 V DC where externally referenced |
| Operating Temperature | 0°C to +55°C industrial grade for the board environment |
| Storage Temperature | -20°C to +70°C |
| Humidity Tolerance | 5% to 95% RH, non-condensing |
| EMC and Protection | Shielded PCB layout and compliant design for high electromagnetic interference environments found on bonder floors |
| Status Indication | On-board indication for board activity and fault conditions as fitted by revision |
| Mounting | Plug-in card for the K&S bonder control chassis or card cage |
| Approximate Weight | Approximately 2.6 kg as a complete board assembly with mounting hardware; lighter for bare PCB variants |
| Country of Origin | United States |
| Condition Availability | New OEM, refurbished, and tested surplus |
| Product Lifecycle Status | Legacy part; sourced through verified OEM and surplus channels for installed base support |
Main Features and Advantages
Thermal accuracy that protects bond quality: The reason a wire bonder needs a dedicated temperature board rather than a general-purpose input card is that thermosonic bonding is sensitive to small thermal changes. The Kulicke & Soffa 8002-4192 conditions sensor feedback and returns it to the controller with the stability the process loop requires, so the workholder holds its setpoint through a production run instead of drifting as the machine warms. Stable temperature means consistent intermetallic formation, consistent pull-test results and fewer marginal bonds escaping into final test.
Signal integrity in an electrically hostile environment: A bonder cabinet is a difficult place for low-level analogue signals, with ultrasonic generators, servo amplifiers and stepper drivers sharing the same enclosure. The shielded PCB layout and low-drift design of the Kulicke & Soffa 8002-4192 keep temperature readings clean in those conditions, which prevents the thermal loop from chasing noise and producing the kind of intermittent fault that is hardest to diagnose on a production floor.
Combined temperature and I/O handling in one slot: Rather than dedicating separate cards to thermal feedback and general discrete interfacing, the Kulicke & Soffa 8002-4192 brings both functions together for the machine section it serves. That reduces card count in the cage, shortens the signal path between measurement and control, and gives engineering teams one clearly identified board to check when a group of thermal or I/O symptoms appears.
Drop-in replacement that restores calibration: Because the board is built to the original K&S specification, a replacement Kulicke & Soffa 8002-4192 installs into the existing chassis without rewiring, firmware modification or mechanical adaptation, and the machine retains its original temperature I/O signal characteristics and calibration. For a line running qualified processes, avoiding re-qualification after a board swap is often worth more than the part itself.
Downtime reduction for high-utilisation lines: In semiconductor assembly, an idle bonder is lost output that cannot be recovered later in the shift. Holding a verified Kulicke & Soffa 8002-4192 in the spares store turns a thermal fault from a multi-day waiting period into a same-shift card swap, and because the board is a field-replaceable assembly rather than a component-level repair, the work is within the capability of an equipment technician rather than a specialist electronics workshop.
